Assignment of Assignor's Interest

Recorded: 2023-04-03 Pages: 6

Assignors

CHIDAMBARAM, VIVEK

Executed: 2023-03-24

BURK, JONATHAN

Executed: 2023-03-22

ZOU, ZHIHUA

Executed: 2023-03-23

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Microelectronic Assemblies with Direct Bonding Using Nanotwinned Copper

Application: 18/194,702 →

Publication: US 2024/0332237

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.