IP Library › Assignment 063311/0220
Patent Assignment
Reel/Frame 063311/0220

Assignment of Assignor's Interest

Recorded: 2023-04-13 Pages: 4
Assignors
CHEN, SHIH-WEI
Executed: 2023-04-10
TENG, PO-YUAN
Executed: 2023-04-11
LIU, CHIAHUNG
Executed: 2023-04-10
TSAI, HAO-YI
Executed: 2023-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Method for Forming Mark, Packaging Method of Semiconductor Device, and Semiconductor Device Having the Mark
Application: 18/099,715 →
Publication: US 2024/0178152
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Execution Dates for All Inventor Previously Recorded at Reel: 063311 Frame: 0220. Assignor(S) Hereby Confirms the Assignment. Jan 2, 2024
From: CHEN, SHIH-WEI; TENG, PO-YUAN; LIU, CHIAHUNG; TSAI, HAO-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 066176/0534 →