IP Library › Assignment 066176/0534
Patent Assignment
Reel/Frame 066176/0534

Corrective Assignment to Correct the the Execution Dates for All Inventor Previously Recorded at Reel: 063311 Frame: 0220. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2024-01-02 Pages: 5
Assignors
CHEN, SHIH-WEI
Executed: 2023-09-11
TENG, PO-YUAN
Executed: 2023-09-14
LIU, CHIAHUNG
Executed: 2023-09-11
TSAI, HAO-YI
Executed: 2023-09-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Method for Forming Mark, Packaging Method of Semiconductor Device, and Semiconductor Device Having the Mark
Application: 18/099,715 →
Publication: US 2024/0178152
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2023
From: CHEN, SHIH-WEI; TENG, PO-YUAN; LIU, CHIAHUNG; TSAI, HAO-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063311/0220 →