Patent Assignment
Reel/Frame 063326/0219
Assignment of Assignor's Interest
Recorded: 2023-04-14
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Undercut Architectures for Improved Thermal Efficiency in Photonic Integrated Circuit (Pic) Architectures
Application:
18/189,911 →
Publication:
US 2024/0319457
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.