Patent Assignment
Reel/Frame 063741/0181
Corrective Assignment to Correct the Assignee's Name to Include Missing Comma in Name Previously Recorded on Reel 059115 Frame 0320. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2023-05-23
Pages: 15
Assignors
NEELY, MATTHEW D.
Executed: 2022-01-06
LEN, MICHAEL
Executed: 2021-12-16
LEUNG, KING YIP
Executed: 2021-12-14
Assignee
TTM TECHNOLOGIES, INC.
200 EAST STANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Methods for Forming Engineered Thermal Paths of Printed Circuit Boards by Use of Removable Layers
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 28, 2022
From: NEELY, MATTHEW D.; LEN, MICHAEL; LEUNG, KING YIP
To: TTM TECHNOLOGIES INC.
Reel/Frame 059115/0320 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →