IP Library Assignment 063927/0355
Patent Assignment
Reel/Frame 063927/0355

Merger and Change of Name

Recorded: 2023-06-12 Pages: 7
Assignors
LITE-ON SEMICONDUCTOR CORPORATION
Executed: 2023-05-02
DIODES TAIWAN S.A R.L.
Executed: 2023-05-02
Assignee
DIODES TAIWAN S.A R.L.
7F., NO. 50, MINQUAN RD., XINDIAN DIST.,, NEW TAIPEI CITY, TAIWAN
Covered Properties (17)
Overvoltage Protection Device and Manufacturing Process for the Same
Patent: 7,129,144 →
Application: 10/834,840 →
Publication: US 2005/0245006
Image Sensor Device and a Method for Outputting Digital Signals
Patent: 7,268,334 →
Application: 11/195,783 →
Publication: US 2007/0029461
Bridge Rectifier and Method for Same
Patent: 8,987,870 →
Application: 13/935,899 →
Publication: US 2015/0008564
Diode Device and Manufacturing Method Thereof
Patent: 9,859,447 →
Application: 15/090,966 →
Publication: US 2017/0148927
Super-Junction Semiconductor Device
Patent: 9,711,636 →
Application: 15/137,386 →
Publication: US 2017/0179276
Oscillator Circuit with Temperature Compensation Function
Application: 15/482,789 →
Publication: US 2018/0123513
Proximity Sensing Device and Optical Sensing Circuit Having Proximity Sensing Function
Application: 15/482,805 →
Publication: US 2018/0120475
Ambient Light Sensor with Photodiode Leakage Current Compensation
Application: 15/643,641 →
Publication: US 2018/0266879
Optoelectronic Receiver Circuit with Dark Current Correction Function and Dark Current Correction Method Thereof
Application: 15/799,448 →
Publication: US 2019/0097733
Light Sensor Device Controlled with Dual-Mode Master-and-Slave MCU Application
Application: 16/386,377 →
Publication: US 2020/0333754
Optical Proximity Sensor with Self-Compensation for Ambient Light and Crosstalk Using Light-to-Frequency Conversion Technique
Application: 16/449,398 →
Publication: US 2020/0363513
Method for Low-Current Oscillatory Circuit with Wide Operation Voltage and Temperature Compensation
Application: 16/827,971 →
Direct Cooling Power Semiconductor Package
Application: 17/009,762 →
Publication: US 2021/0358833
Multi-Sided Cooling Semiconductor Package and Method of Manufacturing the Same
Application: 17/012,075 →
Publication: US 2021/0358876
Digital Device Using Three States
Application: 17/073,624 →
Low Power Operation Method for Apparatus Having Data Transmission Rate
Application: 17/073,626 →
Publication: US 2022/0121265
POWER MODULE With Housing Having Bending Sections
Application: 17/140,145 →
Publication: US 2021/0210409
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 30, 2004
From: TSENG, CHING CHIU
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 015282/0546 →
Assignment of Assignor's Interest Aug 3, 2005
From: TSOU, MING-CHIEH
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 016861/0096 →
Assignment of Assignor's Interest Jul 5, 2013
From: TSENG, CHING-CHIU
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 030743/0580 →
Assignment of Assignor's Interest Apr 5, 2016
From: YU, SHIH-HAN; TSAI, SUNG-YING; CHANG, YU-HUNG; CHUANG, JU-HSU
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 038195/0069 →
Assignment of Assignor's Interest Apr 25, 2016
From: GUO, JIA-JAN; HSU, CHIH-WEI; CHUANG, JU-HSU; YU, SHIH-HAN
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 038369/0711 →
Assignment of Assignor's Interest Apr 9, 2017
From: LEE, SHENG-CHENG; LIN, WEN-SHENG; LAN, SHIH-HAO
To: NATIONAL TSING HUA UNIVERSITY (TAIWAN)
Reel/Frame 041935/0285 →
Assignment of Assignor's Interest Apr 9, 2017
From: LIN, WEN-SHENG; LEE, SHENG-CHENG; LAN, SHIH-HAO
To: DYNA IMAGE CORP.
Reel/Frame 041935/0222 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 041935 Frame: 0285. Assignor(S) Hereby Confirms the Assignment. Jul 7, 2017
From: LEE, SHENG-CHENG; LIN, WEN-SHENG; LAN, SHIH-HAO
To: DYNA IMAGE CORP.
Reel/Frame 043126/0590 →
Assignment of Assignor's Interest Jul 7, 2017
From: LEE, SHENG-CHENG; LIN, WEN-SHENG; LAN, SHIH-HAO
To: DYNA IMAGE CORP.
Reel/Frame 042929/0208 →
Assignment of Assignor's Interest Oct 31, 2017
From: LIN, WEN-SHENG; LEE, SHENG-CHENG
To: DYNA IMAGE CORP.
Reel/Frame 043997/0001 →
Assignment of Assignor's Interest Apr 17, 2019
From: LIN, CHUN-HSIEN; CHAN, PENG-HAN; LIN, WEN-SHENG; SU, YU-CHENG
To: DYNA IMAGE CORPORATION
Reel/Frame 048922/0750 →
Assignment of Assignor's Interest Jun 23, 2019
From: LIN, WEN-SHENG; LEE, SHENG-CHENG; SU, YU-CHENG; CHAN, PENG-HAN
To: DYNA IMAGE CORP.
Reel/Frame 049560/0183 →
Assignment of Assignor's Interest Mar 24, 2020
From: LEE, SHENG-CHENG; LIN, WEN-SHENG; SU, YU-CHENG; LIN, CHUN-HSIEN
To: DYNA IMAGE CORPORATION
Reel/Frame 052209/0283 →
Assignment of Assignor's Interest Sep 9, 2020
From: TZU, CHUNG HSING; TU, MENG-HSUN
To: LITE-ON SEMICONDUCTOR CORPORATION
Reel/Frame 053717/0131 →
Assignment of Assignor's Interest Sep 10, 2020
From: TZU, CHUNG HSING
To: LITE-ON SEMICONDUCTOR CORPORATION
Reel/Frame 053729/0129 →
Assignment of Assignor's Interest Oct 19, 2020
From: CHAN, PENG-HAN; LIN, CHUN-HSIEN; LEE, SHENG-CHENG; LIN, WEN-SHENG
To: DYNA IMAGE CORPORATION
Reel/Frame 054094/0519 →
Assignment of Assignor's Interest Oct 19, 2020
From: CHAN, PENG-HAN; LIN, CHUN-HSIEN; LEE, SHENG-CHENG; LIN, WEN-SHENG
To: DYNA IMAGE CORPORATION
Reel/Frame 054094/0654 →
Assignment of Assignor's Interest Nov 11, 2020
From: DYNA IMAGE CORPORATION
To: DYNA IMAGE CORPORATION; LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 054342/0017 →
Security Agreement Nov 13, 2020
From: DYNA IMAGE CORPORATION
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 055348/0643 →
Security Agreement Nov 13, 2020
From: DYNA IMAGE CORPORATION
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 054857/0398 →
Security Agreement Nov 13, 2020
From: DYNA IMAGE CORPORATION
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 054435/0363 →
Security Agreement Nov 13, 2020
From: DYNA IMAGE CORPORATION
To: LITE-ON SEMICONDUCTOR CORP.
Reel/Frame 054402/0286 →
Corrective Assignment to Correct the Incorrectly Entered Application Number Previously Recorded at Reel: 054094 Frame: 0519. Assignor(S) Hereby Confirms the Assignment. Nov 25, 2020
From: CHAN, PENG-HAN; LIN, CHUN-HSIEN; LEE, SHENG-CHENG; LIN, WEN-SHENG
To: DYNA IMAGE CORPORATION
Reel/Frame 054516/0189 →
Assignment of Assignor's Interest Jan 5, 2021
From: HAN, WEI-KUO; LEE, CHIA-YEN; CHANG, JING-YAO; CHANG, TAO-CHIH
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE; LITE-ON SEMICONDUCTOR CORPORATION
Reel/Frame 054819/0703 →
Change of Name Mar 19, 2026
From: DIODES TAIWAN S.A R.L.
To: DIODES TAIWAN LLC
Reel/Frame 075173/0545 →