Patent Assignment
Reel/Frame 063998/0521
Assignment of Assignor's Interest
Recorded: 2023-06-20
Pages: 3
Assignor
HUANG, KANG
Executed: 2023-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
High-K Isolation of Fin Structures
Application:
18/337,887 →
Publication:
US 2024/0429312
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 3, 2023
From: SUEN, SHICH-CHANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 064137/0802 →
Assignment of Assignor's Interest
Apr 16, 2025
From: JUO, DENG-MING; PAN, WAN-CHUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 070860/0744 →