IP Library › Assignment 070860/0744
Patent Assignment
Reel/Frame 070860/0744

Assignment of Assignor's Interest

Recorded: 2025-04-16 Pages: 3
Assignors
JUO, DENG-MING
Executed: 2023-09-05
PAN, WAN-CHUN
Executed: 2023-10-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
High-K Isolation of Fin Structures
Application: 18/337,887 →
Publication: US 2024/0429312
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2023
From: HUANG, KANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 063998/0521 →
Assignment of Assignor's Interest Jul 3, 2023
From: SUEN, SHICH-CHANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 064137/0802 →