Patent Assignment
Reel/Frame 064246/0060
Assignment of Assignor's Interest
Recorded: 2023-07-13
Pages: 7
Assignors
CHIU, CHIA-PIN
Executed: 2023-05-30
HOANG, TIM T.
Executed: 2023-06-07
HOSSEINI, KAVEH
Executed: 2023-05-30
KARHADE, OMKAR G.
Executed: 2023-06-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stacked Package Design for More Reliable Fiber Coupling to Photonic Integrated Circuit
Application:
18/343,175 →
Publication:
US 2025/0004206
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.