Patent Assignment
Reel/Frame 064249/0807
Assignment of Assignor's Interest
Recorded: 2023-07-13
Pages: 10
Assignors
CHIU, CHIA-PIN
Executed: 2022-04-13
HOSSEINI, KAVEH
Executed: 2022-04-14
KARHADE, OMKAR
Executed: 2022-04-06
HOANG, TIM TRI
Executed: 2023-02-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Undercut Design with a Bonded Base Cover for Friendly Assembly and Effective Thermal Tuning of Micro-Ring Resonator (Mrr) in Open Cavity Photonic Integrated Chips (Ocpic)
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.