IP Library › Assignment 064379/0733
Patent Assignment
Reel/Frame 064379/0733

Assignment of Assignor's Interest

Recorded: 2023-07-25 Pages: 2
Assignor
KIA MOTORS CORPORATION
Executed: 2023-07-21
Assignee
KIA CORPORATION
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 06797, KOREA, REPUBLIC OF
Covered Property (1)
Method and Structure to Control the Solder Thickness for Double Sided Cooling Power Module
Application: 18/226,119 →
Publication: US 2023/0369275
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2023
From: KIM, TAE HWA; YOU, MYUNG ILL
To: HYUNDAI MOTOR COMPANY; KIA MOTORS CORPORATION
Reel/Frame 064382/0633 →