IP Library › Assignment 064382/0633
Patent Assignment
Reel/Frame 064382/0633

Assignment of Assignor's Interest

Recorded: 2023-07-25 Pages: 6
Assignors
KIM, TAE HWA
Executed: 2020-09-15
YOU, MYUNG ILL
Executed: 2020-09-15
Assignees
HYUNDAI MOTOR COMPANY
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 06797, KOREA, REPUBLIC OF
KIA MOTORS CORPORATION
12, HEOLLEUNG-RO, SEOCHO-GU, SEOUL, 06797, KOREA, REPUBLIC OF
Covered Property (1)
Method and Structure to Control the Solder Thickness for Double Sided Cooling Power Module
Application: 18/226,119 →
Publication: US 2023/0369275
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2023
From: KIA MOTORS CORPORATION
To: KIA CORPORATION
Reel/Frame 064379/0733 →