IP Library › Assignment 064540/0624
Patent Assignment
Reel/Frame 064540/0624

Assignment of Assignor's Interest

Recorded: 2023-08-09 Pages: 4
Assignors
KIM, JIN YOUNG
Executed: 2011-11-11
PARK, DOO HYUN
Executed: 2011-11-17
LEE, SEUNG JAE
Executed: 2011-11-11
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties (3)
Fan-Out Semiconductor Package
Patent: 9,214,434 →
Application: 14/017,802 →
Stiffener Package and Method of Fabricating Stiffener Package
Application: 16/740,770 →
Publication: US 2020/0328091
Stiffener Package and Method of Fabricating Stiffener Package
Application: 17/459,706 →
Publication: US 2022/0130682
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest Mar 26, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 055732/0793 →
Assignment of Assignor's Interest Nov 3, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 058008/0423 →