Patent Assignment
Reel/Frame 064660/0294
Assignment of Assignor's Interest
Recorded: 2023-08-22
Pages: 2
Assignor
TAKEUCHI, KOICHI
Executed: 2023-07-12
Assignee
SONY GROUP CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 1080075, JAPAN
Covered Property
(1)
Semiconductor Substrate, Manufacturing Method for Semiconductor Substrate, and Electronic Device Having Semiconductor Substrate
Application:
18/547,344 →
Publication:
US 2024/0120259
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.