Patent Assignment
Reel/Frame 074721/0815
Assignment of Assignor's Interest
Recorded: 2026-02-09
Pages: 4
Assignor
SONY GROUP CORPORATION
Executed: 2025-09-30
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHICHO, ATSUGI-SHI, KANAGAWA, JAPAN
Covered Properties
(2)
Semiconductor Device, Electronic Device, and Method for Manufacturing Semiconductor Device
Application:
18/260,255 →
Publication:
US 2024/0055461
Semiconductor Substrate, Manufacturing Method for Semiconductor Substrate, and Electronic Device Having Semiconductor Substrate
Application:
18/547,344 →
Publication:
US 2024/0120259
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.