Patent Assignment
Reel/Frame 064925/0595
Assignment of Assignor's Interest
Recorded: 2023-09-15
Pages: 4
Assignors
MIYAMOTO, MASATO
Executed: 2023-02-01
OGAWA, HIROYUKI
Executed: 2023-02-02
KUBO, TOMOHIRO
Executed: 2023-02-02
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Properties
(2)
Three-Dimensional Memory Device Containing Integrated Contact-and-Support Assemblies and Methods of Making the Same
Three-Dimensional Memory Device Containing Integrated Contact-and-Support Assemblies and Methods of Making the Same
Application:
63/476,448 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 2, 2023
From: MIYAMOTO, MASATO; OGAWA, HIROYUKI; KUBO, TOMOHIRO
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 062573/0091 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →