Patent Assignment
Reel/Frame 065161/0229
Assignment of Assignor's Interest
Recorded: 2023-10-09
Pages: 4
Assignors
YU, JIXIN
Executed: 2023-03-29
MATSUNO, KOICHI
Executed: 2023-03-29
ZHU, RUOGU MATTHEW
Executed: 2023-03-29
ALSMEIER, JOHANN
Executed: 2023-03-29
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Properties
(2)
Three-Dimensional Memory Device Containing Composite Dielectric Isolation Structure in a Staircase Region and Methods of Forming the Same
Application:
18/360,541 →
Publication:
US 2024/0334695
Three-Dimensional Memory Device Containing Composite Dielectric Isolation Structure in a Staircase Region and Methods of Forming the Same
Application:
63/492,566 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 30, 2023
From: YU, JIXIN; MATSUNO, KOICHI; ZHU, RUOGU MATTHEW; ALSMEIER, JOHANN
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 063160/0200 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →