IP Library Assignment 065413/0802
Patent Assignment
Reel/Frame 065413/0802

Assignment of Assignor's Interest

Recorded: 2023-10-31 Pages: 4
Assignors
GOGINENI, SIREESHA
Executed: 2017-09-19
KIM, ANDREW
Executed: 2017-09-19
SHE, YONG
Executed: 2017-09-20
BLUE, KARISSA J.
Executed: 2017-09-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stacked Die Semiconductor Package Spacer Die
Application: 16/642,815 →
Publication: US 2020/0350227
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0592 →