IP Library › Assignment 065563/0247
Patent Assignment
Reel/Frame 065563/0247

Change of Name

Recorded: 2023-11-13 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Stacked Devices and Methods of Fabrication
Application: 17/586,236 →
Publication: US 2022/0189941
Stacked Devices and Methods of Fabrication
Application: 18/507,478 →
Publication: US 2024/0088120
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 18, 2022
From: ENQUIST, PAUL M.; HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 059051/0587 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Nov 13, 2023
From: ENQUIST, PAUL M.; HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065545/0299 →