Patent Assignment
Reel/Frame 065792/0393
Change of Name
Recorded: 2023-12-06
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
Bond Enhancement in Microelectronics by Trapping Contaminants and Arresting Cracks During Direct-Bonding Processes
Application:
16/553,879 →
Publication:
US 2020/0075533
Method and Structures for Low Temperature Device Bonding
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2019
From: GAO, GUILIAN; DELACRUZ, JAVIER A.; HUANG, SHAOWU; WANG, LIANG
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051080/0867 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest
Dec 5, 2023
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 065772/0264 →