IP Library › Assignment 066061/0427
Patent Assignment
Reel/Frame 066061/0427

Assignment of Assignor's Interest

Recorded: 2024-01-09 Pages: 12
Assignors
KELLY, MICHAEL G.
Executed: 2014-01-17
HINER, DAVID JON
Executed: 2014-01-17
HUEMOELLER, RONALD
Executed: 2014-01-17
LEE, JI HUN
Executed: 2014-01-17
DO, WON CHUL
Executed: 2014-01-14
PARK, DOO HYUN
Executed: 2014-01-14
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Method of manufacturing a semiconductor package
Patent: 9,627,353 →
Application: 15/240,534 →
Publication: US 2017/0005070
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →