Patent Assignment
Reel/Frame 066133/0956
Assignment of Assignor's Interest
Recorded: 2023-12-29
Pages: 43
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491 B RIVER VALLEY ROAD, VALLEY POINT #12/03, SINGAPORE, 248373, SINGAPORE
Covered Property
(1)
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 29, 2023
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066143/0842 →
Assignment of Assignor's Interest
Dec 29, 2023
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066143/0847 →
Assignment of Assignor's Interest
Apr 30, 2025
From: PARK, JUNG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 070989/0089 →