Patent Assignment
Reel/Frame 070989/0089
Assignment of Assignor's Interest
Recorded: 2025-04-30
Pages: 5
Assignor
PARK, JUNG SOO
Executed: 2022-09-26
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Electronic Device Having a Substrate-to-Substrate Interconnection Structure and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 29, 2023
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 066133/0956 →
Assignment of Assignor's Interest
Dec 29, 2023
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066143/0842 →
Assignment of Assignor's Interest
Dec 29, 2023
From: PARK, JOON YOUNG; YOON, JI HYE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 066143/0847 →