Patent Assignment
Reel/Frame 066209/0832
Assignment of Assignor's Interest
Recorded: 2024-01-23
Pages: 15
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2019-12-27
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2024
From: BRIGGS, BENJAMIN DAVID; CLEVENGER, LAWRENCE A.; DEPROSPO, BARTLET H.; HUANG, HUAI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 066362/0241 →
Change of Name
Jan 23, 2024
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 066362/0249 →
Change of Name
Jan 23, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 066362/0254 →