Patent Assignment
Reel/Frame 066362/0241
Assignment of Assignor's Interest
Recorded: 2024-01-23
Pages: 5
Assignors
BRIGGS, BENJAMIN DAVID
Executed: 2016-06-30
CLEVENGER, LAWRENCE A.
Executed: 2016-06-30
DEPROSPO, BARTLET H.
Executed: 2016-06-30
HUANG, HUAI
Executed: 2016-06-30
PENNY, CHRISTOPHER J.
Executed: 2016-06-30
RIZZOLO, MICHAEL
Executed: 2016-06-30
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
1 NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2024
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 066209/0832 →
Change of Name
Jan 23, 2024
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 066362/0249 →
Change of Name
Jan 23, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 066362/0254 →