Patent Assignment
Reel/Frame 066292/0741
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 6
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(3)
Stacked Redistribution Layer (Rdl) Die Assembly Package
Patent:
7,825,520 →
Application:
12/387,672 →
Stacked Redistribution Layer (Rdl) Die Assembly Package
Patent:
8,203,203 →
Application:
12/924,493 →
Stacked Redistribution Layer (Rdl) Die Assembly Package
Patent:
8,629,546 →
Application:
13/487,705 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →