Patent Assignment
Reel/Frame 066292/0945
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 3
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(5)
Method of Forming a Stack of Semiconductor Packages
Patent:
7,459,349 →
Application:
11/254,339 →
Stackable Semiconductor Package
Patent:
7,737,542 →
Application:
12/291,119 →
Stackable Semiconductor Package
Patent:
7,982,306 →
Application:
12/799,751 →
Stackable Semiconductor Package
Patent:
8,227,905 →
Application:
12/931,325 →
Stackable Semiconductor Package
Patent:
8,466,545 →
Application:
13/528,199 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →