Patent Assignment
Reel/Frame 066296/0900
Assignment of Assignor's Interest
Recorded: 2024-01-30
Pages: 3
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2008-06-17
ST. AMAND, ROGER D.
Executed: 2008-06-16
DARVEAUX, ROBERT FRANCIS
Executed: 2008-06-19
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Flip Chip Bump Structure and Fabrication Method
Patent:
8,390,116 →
Application:
13/065,298 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →