Patent Assignment
Reel/Frame 066314/0895
Assignment of Assignor's Interest
Recorded: 2024-01-31
Pages: 3
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Nanowire Bonding Interconnect for Fine-Pitch Microelectronics
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Feb 8, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 066541/0096 →
Corrective Assignment to Correct the the Second Conveying Name Previously Recorded at Reel: 66314 Frame: 895. Assignor(S) Hereby Confirms the Assignment.
Mar 8, 2024
From: HABA, BELGACEM; MOHAMMED, ILYAS
To: INVENSAS CORPORATION
Reel/Frame 066785/0566 →