IP Library Assignment 066785/0566
Patent Assignment
Reel/Frame 066785/0566

Corrective Assignment to Correct the the Second Conveying Name Previously Recorded at Reel: 66314 Frame: 895. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2024-03-08 Pages: 5
Assignors
HABA, BELGACEM
Executed: 2020-01-27
MOHAMMED, ILYAS
Executed: 2020-01-27
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Nanowire Bonding Interconnect for Fine-Pitch Microelectronics
Application: 17/811,713 →
Publication: US 2023/0105341
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Jan 31, 2024
From: HABA, BELGACEM; MOHAMMED, HYAS
To: INVENSAS CORPORATION
Reel/Frame 066314/0895 →
Change of Name Feb 8, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 066541/0096 →