Patent Assignment
Reel/Frame 066505/0320
Assignment of Assignor's Interest
Recorded: 2024-02-20
Pages: 6
Assignors
BHARATAN, SUSHIL
Executed: 2023-10-16
CHASE, TROY
Executed: 2023-10-18
AKIYAMA, JOTARO
Executed: 2023-10-12
Assignee
INVENSENSE, INC.
1745 TECHNOLOGY DRIVE, SUITE 200, SAN JOSE, CALIFORNIA, 95110
Covered Property
(1)
Microelectromechanical Acoustic Sensor with Membrane Etch Release Structures and Method of Fabrication
Application:
18/490,312 →
Publication:
US 2024/0133736
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2024
From: ROMBACH, PIRMIN; RASMUSSEN, KURT; MORTENSEN, DENNIS; RAVNKILDE, JAN
To: TDK ELECTRONICS AG
Reel/Frame 066505/0331 →
Assignment of Assignor's Interest
Dec 17, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 073964/0659 →
Assignment of Assignor's Interest
Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →