Patent Assignment
Reel/Frame 073964/0659
Assignment of Assignor's Interest
Recorded: 2025-12-17
Pages: 4
Assignor
TDK ELECTRONICS AG
Executed: 2025-08-07
Assignee
TDK CORPORATION
2-5-1 NIHONBASHI, CHUO-KU, TOKYO, 103-6218, JAPAN
Covered Properties
(4)
Microelectromechanical Acoustic Sensor with Membrane Etch Release Structures and Method of Fabrication
Application:
18/490,312 →
Publication:
US 2024/0133736
Electrodes for Microelectromechanical System Microphones
Application:
18/448,601 →
Publication:
US 2024/0171917
Stress Reduced Diaphragm for a Micro-Electro-Mechanical System Sensor
Edge Patterns of Microelectromechanical Systems (Mems) Microphone Backplate Holes
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 4, 2019
From: ROMBACH, PIRMIN; BHARATAN, SUSHIL
To: INVENSENSE, INC.; TDK ELECTRONICS AG
Reel/Frame 050258/0211 →
Assignment of Assignor's Interest
Oct 2, 2021
From: INVENSENSE TAIWAN, LTD.
To: INVENSENSE, INC.
Reel/Frame 057679/0674 →
Assignment of Assignor's Interest
Oct 2, 2021
From: MORTENSEN, DENNIS; ROMBACH, PIRMIN
To: TDK ELECTRONICS AG
Reel/Frame 057679/0682 →
Assignment of Assignor's Interest
Oct 2, 2021
From: LIN, CHUNG-HSIEN; TANG, TSUNG LIN; WU, CHIA-YU
To: INVENSENSE TAIWAN, LTD.
Reel/Frame 057679/0666 →
Assignment of Assignor's Interest
Aug 11, 2023
From: MORTENSEN, DENNIS
To: TDK ELECTRONICS AG
Reel/Frame 064566/0358 →
Assignment of Assignor's Interest
Aug 11, 2023
From: SEEGER, JOSEPH
To: INVENSENSE, INC.
Reel/Frame 064566/0314 →
Assignment of Assignor's Interest
Feb 20, 2024
From: ROMBACH, PIRMIN; RASMUSSEN, KURT; MORTENSEN, DENNIS; RAVNKILDE, JAN
To: TDK ELECTRONICS AG
Reel/Frame 066505/0331 →
Assignment of Assignor's Interest
Feb 20, 2024
From: BHARATAN, SUSHIL; CHASE, TROY; AKIYAMA, JOTARO
To: INVENSENSE, INC.
Reel/Frame 066505/0320 →
Assignment of Assignor's Interest
Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →