Patent Assignment
Reel/Frame 057679/0666
Assignment of Assignor's Interest
Recorded: 2021-10-02
Pages: 8
Assignors
LIN, CHUNG-HSIEN
Executed: 2021-07-30
TANG, TSUNG LIN
Executed: 2021-07-30
WU, CHIA-YU
Executed: 2021-08-01
Assignee
INVENSENSE TAIWAN, LTD.
HSINGCHU SCIENCE PARK, NO. 1F B6 LI-HSIN 1ST ROAD, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Edge Patterns of Microelectromechanical Systems (Mems) Microphone Backplate Holes
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2021
From: INVENSENSE TAIWAN, LTD.
To: INVENSENSE, INC.
Reel/Frame 057679/0674 →
Assignment of Assignor's Interest
Oct 2, 2021
From: MORTENSEN, DENNIS; ROMBACH, PIRMIN
To: TDK ELECTRONICS AG
Reel/Frame 057679/0682 →
Assignment of Assignor's Interest
Dec 17, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 073964/0659 →
Assignment of Assignor's Interest
Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →