Patent Assignment
Reel/Frame 057679/0674
Assignment of Assignor's Interest
Recorded: 2021-10-02
Pages: 3
Assignor
INVENSENSE TAIWAN, LTD.
Executed: 2021-07-30
Assignee
INVENSENSE, INC.
1745 TECHNOLOGY DRIVE, SUITE 200, SAN JOSE, CALIFORNIA, 95110
Covered Property
(1)
Edge Patterns of Microelectromechanical Systems (Mems) Microphone Backplate Holes
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2021
From: LIN, CHUNG-HSIEN; TANG, TSUNG LIN; WU, CHIA-YU
To: INVENSENSE TAIWAN, LTD.
Reel/Frame 057679/0666 →
Assignment of Assignor's Interest
Oct 2, 2021
From: MORTENSEN, DENNIS; ROMBACH, PIRMIN
To: TDK ELECTRONICS AG
Reel/Frame 057679/0682 →
Assignment of Assignor's Interest
Dec 17, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 073964/0659 →
Assignment of Assignor's Interest
Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →