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Patent Assignment
Reel/Frame 057679/0682

Assignment of Assignor's Interest

Recorded: 2021-10-02 Pages: 4
Assignors
MORTENSEN, DENNIS
Executed: 2021-08-16
ROMBACH, PIRMIN
Executed: 2021-08-16
Assignee
TDK ELECTRONICS AG
ROSENHEIMER STR. 141 E, MÜNCHEN, 81671, GERMANY
Covered Property (1)
Edge Patterns of Microelectromechanical Systems (Mems) Microphone Backplate Holes
Application: 17/211,512 →
Publication: US 2022/0070568
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 2, 2021
From: LIN, CHUNG-HSIEN; TANG, TSUNG LIN; WU, CHIA-YU
To: INVENSENSE TAIWAN, LTD.
Reel/Frame 057679/0666 →
Assignment of Assignor's Interest Oct 2, 2021
From: INVENSENSE TAIWAN, LTD.
To: INVENSENSE, INC.
Reel/Frame 057679/0674 →
Assignment of Assignor's Interest Dec 17, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 073964/0659 →
Assignment of Assignor's Interest Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →