Patent Assignment
Reel/Frame 066505/0331
Assignment of Assignor's Interest
Recorded: 2024-02-20
Pages: 8
Assignors
ROMBACH, PIRMIN
Executed: 2023-10-24
RASMUSSEN, KURT
Executed: 2023-10-25
MORTENSEN, DENNIS
Executed: 2023-10-25
RAVNKILDE, JAN
Executed: 2023-10-24
LIU, CHENG-YEN
Executed: 2023-10-25
Assignee
TDK ELECTRONICS AG
ROSENHEIMER STRASSE 116B, FLOOR 7, MUNICH, 81669, GERMANY
Covered Property
(1)
Microelectromechanical Acoustic Sensor with Membrane Etch Release Structures and Method of Fabrication
Application:
18/490,312 →
Publication:
US 2024/0133736
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2024
From: BHARATAN, SUSHIL; CHASE, TROY; AKIYAMA, JOTARO
To: INVENSENSE, INC.
Reel/Frame 066505/0320 →
Assignment of Assignor's Interest
Dec 17, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 073964/0659 →
Assignment of Assignor's Interest
Mar 3, 2026
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 075018/0103 →