Patent Assignment
Reel/Frame 066545/0789
Assignment of Assignor's Interest
Recorded: 2024-02-23
Pages: 3
Assignor
HEBERT, FRANCOIS
Executed: 2015-01-22
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 361-725, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Voids Within Silicon-on-Insulator (Soi) Structure and Method of Forming the Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.