IP Library Assignment 066557/0917
Patent Assignment
Reel/Frame 066557/0917

Assignment of Assignor's Interest

Recorded: 2024-02-26 Pages: 3
Assignor
HABA, BELGACEM
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assemblies
Application: 17/937,593 →
Publication: US 2023/0215739
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Feb 26, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066677/0214 →