IP Library › Assignment 066677/0214
Patent Assignment
Reel/Frame 066677/0214

Change of Name

Recorded: 2024-02-26 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Stacked Dies and Methods for Forming Bonded Structures
Application: 18/145,282 →
Publication: US 2023/0130580
Microelectronic Assemblies
Application: 17/937,593 →
Publication: US 2023/0215739
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Feb 26, 2024
From: UZOH, CYPRIAN EMEKA; SITARAM, ARKALGUD R.; ENQUIST, PAUL
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066556/0437 →
Assignment of Assignor's Interest Feb 26, 2024
From: HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066557/0917 →