Patent Assignment
Reel/Frame 066758/0501
Assignment of Assignor's Interest
Recorded: 2024-03-01
Pages: 4
Assignors
KATKAR, RAJESH
Executed: 2019-02-22
MIRKARIMI, LAURA WILLS
Executed: 2019-04-15
LEE, BONGSUB
Executed: 2019-02-22
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2019-02-22
UZOH, CYPRIAN EMEKA
Executed: 2019-02-27
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structures for Bonding Elements Including Conductive Interface Features
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name
Aug 16, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 064615/0911 →
Change of Name
Mar 6, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066745/0324 →