Patent Assignment
Reel/Frame 064615/0911
Change of Name
Recorded: 2023-08-16
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
Structures for Bonding Elements Including Conductive Interface Features
Conductive Barrier Direct Hybrid Bonding
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Assignment of Assignor's Interest
Aug 16, 2023
From: ENQUIST, PAUL M.
To: ZIPTRONIX, INC.
Reel/Frame 064610/0839 →
Change of Name
Aug 16, 2023
From: ZIPTRONIX, INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064615/0374 →
Assignment of Assignor's Interest
Mar 1, 2024
From: KATKAR, RAJESH; MIRKARIMI, LAURA WILLS; LEE, BONGSUB; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066758/0501 →
Change of Name
Mar 6, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066745/0324 →