Patent Assignment
Reel/Frame 066828/0797
Assignment of Assignor's Interest
Recorded: 2024-03-19
Pages: 3
Assignors
KIM, BYONG JIN
Executed: 2010-02-17
SHIN, MIN CHUL
Executed: 2010-02-17
CHOI, HO
Executed: 2010-02-17
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device Having Conductive Pads with Neck-Down Portions to Prevent Solder Reflow
Patent:
9,171,812 →
Application:
14/088,882 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →