Semiconductor device having conductive pads with neck-down portions to prevent solder reflow
View Patent ↗Methods and devices for a semiconductor device having conductive pads to prevent solder reflow are disclosed and may include a substrate comprising conductive pads of rectangular shape and neck-down portions on opposite sides of the rectangular shape, a semiconductor die comprising conductive pillars, and a solder electrically coupling the conductive pillars to the conductive pads. The neck-down portions may comprise a solder mask for the conductive pads to prevent solder from flowing in an unwanted direction on the conductive pads. The conductive pillars may comprise an elliptical cross-section with a minor axis length X and a major axis length Y. The major axis of the elliptical cross-section may be parallel to a long axis of the rectangular shape of the conductive pads. A decrease (W) in width of the conductive pads from the rectangular shape to the neck-down portions may be defined by X/5≦W≦X/2.
1. An electronic component comprising:
a semiconductor die that comprises first and second conductive structures; and
a substrate comprising:
neck-down portions on opposite sides of a first rectangular conductive pad; and
neck-down portions on opposite sides of a second rectangular conductive pad, wherein:
the first and second rectangular conductive pads are aligned along parallel axes and offset longitudinally from each other along their respective axes;
traces extending beyond the neck-down portions on opposite sides of the first and second rectangular conductive pads have a same width as the first and second rectangular conductive pads; and
the first and second conductive structures comprise an elliptical cross-section with a minor axis length X and a major axis length Y and are respectively bonded to the first and second rectangular conductive pads.
2. The electronic component according to claim 1 , wherein the first and second conductive structures comprise conductive pillars.
3. The electronic component according to claim 1 , wherein the major axis of the elliptical cross-section is parallel to a long axis of the first and second rectangular conductive pads.
4. The electronic component according to claim 1 , wherein a decrease (W) in width of the first and second rectangular conductive pads to the neck-down portions is defined by X/5≦W≦X/2, such that a width at the neck-down portions is X−W.
5. The electronic component according to claim 1 , wherein the length (L) of the first and second rectangular conductive pads is defined by Y*(5/4)<L<Y*(3/2).
6. The electronic component according to claim 1 , wherein the substrate comprises a passivation layer having a window through which the first and second rectangular conductive pads are exposed.
7. The electronic component according to claim 1 , wherein the neck-down portions on the opposite sides of the first and second rectangular conductive pads comprise a solder mask for the first and second rectangular conductive pads to prevent solder from flowing in an unwanted direction outside of the first and second rectangular conductive pads.
8. The electronic component according to claim 1 , wherein the neck-down portions comprise semi-circular shapes.
9. The electronic component according to claim 1 , wherein neck-down portions on opposite sides of the first rectangular pad are adjacent to the second rectangular conductive pad.
10. The electronic component according to claim 1 , wherein a distance H of the neck-down portions from the conductive structures is given by the relation Y/2≦H≦Y.
11. An electronic component comprising:
a substrate comprising a plurality of conductive traces generally positioned side-by-side in a first direction; and
a semiconductor die that comprises conductive structures with an elliptical cross-section with a minor axis length X and a minor axis length Y, wherein:
each of the plurality of conductive traces comprises a rectangular die-attach pad and two neck-down portions located on opposite sides of the rectangular die-attach pad in a second direction orthogonal to the first direction;
the rectangular die-attach pads of the conductive traces are staggered in the second direction in an alternating manner;
the conductive structures are bonded to the rectangular die-attach pads; and
the conductive traces extend beyond the neck-down portions and have a same width as the rectangular die-attach pads.
12. The electronic component according to claim 11 , wherein the conductive structures comprise conductive pillars.
13. The electronic component according to claim 11 , wherein the substrate comprises a passivation layer having a window through which the rectangular die-attach pads are exposed.
14. The electronic component according to claim 11 , wherein the neck-down portions comprise a solder mask for the rectangular die-attach pads to prevent solder from flowing in an unwanted direction outside of the rectangular die-attach pads.
15. The electronic component according to claim 11 , wherein the neck-down portions comprise semi-circular shapes.
16. The electronic component according to claim 11 , wherein neck-down portions of a first of the plurality of conductive traces are adjacent to a rectangular die-attach pad of a second of the plurality of conductive traces.
17. A method for a semiconductor component, the method comprising:
providing a semiconductor die that comprises first and second conductive structures; and
providing a substrate comprising:
neck-down portions on opposite sides of a first rectangular conductive pad; and
neck-down portions on opposite sides of a second rectangular conductive pad, wherein:
the first and second rectangular conductive pads are aligned along parallel axes and offset longitudinally from each other along their respective axes;
traces extending beyond the neck-down portions on opposite sides of the first and second rectangular conductive pads have a same width as the first and second rectangular conductive pads; and
the first and second conductive structures comprise an elliptical cross-section with a minor axis length X and a major axis length Y and are respectively bonded to the first and second rectangular conductive pads.