Patent Assignment
Reel/Frame 066938/0053
Assignment of Assignor's Interest
Recorded: 2024-03-28
Pages: 5
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2020-08-29
KATKAR, RAJESH
Executed: 2020-08-24
WORKMAN, THOMAS
Executed: 2020-08-31
GAO, GUILIAN
Executed: 2020-08-24
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2020-08-24
MIRKARIMI, LAURA WILLS
Executed: 2020-09-17
HABA, BELGACEM
Executed: 2020-08-24
GUEVARA, GABRIEL Z.
Executed: 2020-08-28
WATANABE, JOY
Executed: 2020-08-24
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.