IP Library › Assignment 066945/0567
Patent Assignment
Reel/Frame 066945/0567

Change of Name

Recorded: 2024-03-28 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct Bonded Stack Structures for Increased Reliability and Improved Yield in Microelectronics
Application: 18/589,231 →
Publication: US 2024/0203948
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 28, 2024
From: UZOH, CYPRIAN EMEKA; KATKAR, RAJESH; WORKMAN, THOMAS; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 066938/0053 →