Patent Assignment
Reel/Frame 066938/0899
Assignment of Assignor's Interest
Recorded: 2024-03-28
Pages: 3
Assignor
ENEA, VINCENZO
Executed: 2024-02-15
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Air-Gap in Trench Field Plate Power Mosfet for Reduced Power Loss Performance
Application:
18/590,785 →
Publication:
US 2025/0275221
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2024
From: LIAO, CHIA-LIANG; NGWAN, VOON CHENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 066938/0912 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0970 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0001 →