Patent Assignment
Reel/Frame 066938/0912
Assignment of Assignor's Interest
Recorded: 2024-03-28
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Air-Gap in Trench Field Plate Power Mosfet for Reduced Power Loss Performance
Application:
18/590,785 →
Publication:
US 2025/0275221
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2024
From: ENEA, VINCENZO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 066938/0899 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0970 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0001 →