IP Library Assignment 066954/0583
Patent Assignment
Reel/Frame 066954/0583

Assignment of Assignor's Interest

Recorded: 2024-03-29 Pages: 15
Assignors
PAEK, JONG SIK
Executed: 2013-10-10
PARK, DOO HYUN
Executed: 2013-10-10
SEO, SEONG MIN
Executed: 2013-10-14
DO, WON CHUL
Executed: 2013-10-10
SUNG, PIL JE
Executed: 2013-10-10
PARK, JIN HEE
Executed: 2013-10-11
KIM, DO HYUNG
Executed: 2013-10-10
PARK, IN BAE
Executed: 2013-10-14
LEE, CHANG MIN
Executed: 2013-10-14
SONG, YONG
Executed: 2013-10-14
KANG, SUNG GEUN
Executed: 2013-10-14
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die
Patent: 9,190,370 →
Application: 14/725,531 →
Publication: US 2015/0262945
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →