Patent Assignment
Reel/Frame 067121/0229
Assignment of Assignor's Interest
Recorded: 2024-04-16
Pages: 3
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2005-01-27
HINER, DAVID JON
Executed: 2005-01-27
LIE, RUSS
Executed: 2005-01-27
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Multi-Level Circuit Substrate Fabrication Method
Patent:
8,316,536 →
Application:
12/151,857 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →