IP Library Assignment 067150/0397
Patent Assignment
Reel/Frame 067150/0397

Assignment of Assignor's Interest

Recorded: 2024-04-18 Pages: 19
Assignor
ACORN TECHNOLOGIES, INC.
Executed: 2019-05-30
Assignee
ACORN SEMI, LLC
455 CAMBRIDGE AVE., PALO ALTO, CALIFORNIA, 94306
Covered Properties (4)
Strained Semiconductor Using Elastic Edge Relaxation of a Stressor Combined with Buried Insulating Layer
Application: 16/781,260 →
Publication: US 2020/0176602
Strained Semiconductor Using Elastic Edge Relaxation of a Stressor Combined with Buried Insulating Layer
Application: 17/201,728 →
Publication: US 2021/0202741
Strained Semiconductor Using Elastic Edge Relaxation of a Stressor Combined with Buried Insulating Layer
Application: 17/935,515 →
Publication: US 2023/0020403
Strained Semiconductor Using Elastic Edge Relaxation of a Stressor Combined with Buried Insulating Layer
Application: 18/627,266 →
Publication: US 2024/0250172
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2024
From: CLIFTON, PAUL A.; GAINES, R. STOCTON
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 067150/0051 →